Passivation Stress versus Top Metal Profiles by 3D Finite Element Modeling
نویسندگان
چکیده
Passivation hermiticity is always a concern in integration circuit fabrication and application. Passivation stress is one of the key factors for the passivation integrity. In this paper, passivation stress is investigated as a function of top metal profiles with a 3Dimentional Finite Element Modeling (3D FEM). A new structure is proposed for reducing the passivation stress at the corner of a top metal foot to prevent a potential passivation crack. A sloped metal with a curved foot profile is demonstrated. The pros and corns of the new structure are discussed at the end.
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